Hi, just got my PC and #83 isnt getting alot of my water spot etching out and pitting. Im thinking about trying 84 or 85 whats the main difference between these. I know the "try the least agrresive first theory" But ive tried like 10 passes with very little results with 83. So is 85 that much stronger than 84? How carefull should i be with these? thanks
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#84 an #85
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Both 84 and 85 are rotary only products that will not break down using the PC. Before using either of these, you might consider using 83 with a cutting pad if you haven't already. You also need to be very careful using either 84 or 85 as they are pretty aggressive.Quadruple Honda Owner
Black cars are easy!
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Re: #84 an #85
Originally posted by NVCobra
Hi, just got my PC and #83 isn't getting a lot of my water spot etching out and pitting.
It's important to remember that the G-100 dual action polisher is limited in what it can do. More and more people are pushing the envelope and trying to remove defects with this tool that would be better addressed with the rotary buffer.
I'm thinking about trying 84 or 85 whats the main difference between these. I know the "try the least aggressive first theory" But ive tried like 10 passes with very little results with 83. So is 85 that much stronger than 84? How careful should i be with these? thanks
This diminishing abrasive compound is formulated for use with a foam cutting pad. Compounds formulated for use with foam require a richer lubrication film to enable the foam to spin against the surface without creating excess heat. If the formula is to dry, the surface will heat up and performance and results will fall off. It's a balancing act however as the more slippery the surface, the harder it is for the diminishing abrasive to abrade the surface.
M-85 Diamond Cut Compound
This diminishing abrasive compound is formulated for use with a wool cutting pad, it is dryer product than the #84 Compound Power Cleaner and a fast cutter when used with a wool pad.
As far as you question about how careful you should be with these products goes... these products are not formulated or intended to be used with a dual action polisher or an orbital buffer. In order to correctly work the product into and against the surface to remove defects requires the direct drive action offered by the rotary buffer.
Mike
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