In which way differs the foam of W6006 foam pad from Soft Buff 2.0 Cutting pad?

[Black Widow]

In which way differs the foam of the new W6006 foam pad from the Soft Buff 2.0 Cutting pad?

Thanks

[greg0303]

I don't know the details about foam construction on W6006 but it was developed to work specifically with M101 Foam-Cut Compound:

http://www.meguiars.com.hk/product/419

[Black Widow]

Thank you. This information is indeed on the packaging of the path.
Since I like the Soft Buff 2.0 Cutting pad very much, only to big, I wonder if the foam is the same or not.

[Murr1525]

I believe the foam is different, just for that product.

[Michael Stoops]

Both the W6006 and W7207 use closed cell foam, but they still aren't identical. In theory the foam of the W6006 will give better defect removal, but since the W7207 is larger in diameter it gains back some of that disadvantage when used on a rotary. Remember, on a rotary buffer a larger diameter pad (all else being equal) will be more aggressive than a smaller diameter pad. On a DA it's the opposite; smaller is more aggressive. Since the foam of the W6006 is more aggressive and the pad itself is smaller, it will give more cut on a DA than W7207 will, without a doubt. But the foam of the W7207 will retain its stiffness longer under repeated and prolonged heat exposure.


The W6006 was developed specifically to match up with M101 on a rotary under the sort of buffing techniques more commonly found in Europe than in the US. That does not mean that it can't be used on a DA, or with different compounds, etc. What it does mean is that choosing between these two pads is still a matter of what you're trying to do, what your workflow is like, etc

[Black Widow]

Thanks

That's the info I was looking for.